Ultra High-Density 3D/MLC. Pushing The Boundaries.

Spin Memory’s 3D/MLC technologies, currently in the research phase, will be the foundation for the company’s future products for DRAM replacement. We are defining techniques to create 3D magnetics enabling memory densities for magnetic DRAM and Storage-Class Memory, and are accelerating the development of these structures by utilizing our R&D Fab line.

High Density 3D / MLC

Resources

Could a strange new memory chip unlock mysteries of AI?

See the Article

Using MRAM in Place of SRAM

See the White Paper

MRAM Can Be >10,000X More Write-Energy Efficient Than Flash

See the White Paper