Ultra High-Density 3D/MLC. Pushing The Boundaries.

Spin Memory’s 3D/MLC technologies, currently in the research phase, will be the foundation for the company’s future products for DRAM replacement. We are defining techniques to create 3D magnetics enabling memory densities for magnetic DRAM and Storage-Class Memory, and are accelerating the development of these structures by utilizing our R&D Fab line.

Stay Tuned for Further Announcements

High Density 3D / MLC

Resources

Spin Memory Teams with Applied Materials to Produce a Comprehensive Embedded MRAM Solution

See the Press Release

Using MRAM in Place of SRAM

See the White Paper

MRAM Can Be >10,000X More Write-Enegry Efficient Than Flash

See the White Paper